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Residual Stress Measurement

 

Residual stress measurement inside metal components.

 

 X-ray diffraction is used to measure the residual stress inside mechanical components and other building objects. MIRRORCLE uses high-energy white X-ray, which enable deep and non-destructive measurements. Furthermore, the energy dispersive method allows measuring of complex shapes.

 

 

 

Example : Measurement residual stress inside a cog

 

 

 

 Diffracted X-rays at specific depths are measured by varying the sample orientation; the stress is calculated from the extent of the energy shift. Fe (110) X-ray diffraction peak graph (center figure) measured for a tooth in a helical gear (depth 0.2 mm) and residual stress (right figure).

 These plots show that the tensile stress turns into compressive stress at a depth of 0.2 mm.

 

 

 

Example : Measurement residual stress from a strain gauge

 

gauge

Our results using MIRRORCLE:

 43.2 MPa

From stress gauge

 41.6Mpa

 

 

 

X-ray source MIRRORCLE-CV1

X-ray energy

10〜100keV

Optical system Parallel optical system
Detector Germanium semiconductor detector
Sample shape Arbitrary
X-ray diameter Less than 500μm(※)
Measurement region Less than 1cm(※)
Maximum measurement depth Less than 1mm for steel(※)
Depth resolution Greater than 1μm(※)

               ※Depends on conditions of measurement

 

 

 

 

 

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